Multi-SERDES PHY SATA3/PCIe2/XAUI/Fiber Channel

The Innosilicon Multi-SERDES PHY is a highly configurable design that supports SATA3, PCIe2 and XAUI with full compliance. High data rates are accurately achieved through fully programmable TX drivers and auto-calibrated on-die terminations.

The design is completely self-contained including: I/O pads, primary and secondary ESD for simple integration and production testing is simplified through at-speed BIST, loopback and boundary scan.

As with all Innosilicon IP, we are ready to provide the custom solution that meets your needs.

KEY FEATURES:

Silicon proven in 14, 28, 40, 55 and 65nm across SMIC, TSMC and Global Foundries
Compliant with SATA3(6Gb/s), PCIe2(5Gb/s), USB3.0(5Gb/s) and XAUI(3.125Gb/s)
TX drivers are programmable for amplitude, slew rate and de-emphasis to ensure a 200mV to 800mV signal window as appropriate.
On-die terminations are auto-calibrated during handshake for both value and matching
Incorporates spread spectrum clocking (SSC) for all interface implementations with control for spectrum offset, range shape and skew rate
Embedded primary & secondary ESD protection
Integrated IO pads
Production test support is optimized through high coverage at-speed BIST, loopback and boundary scan support

BLOCK DIAGRAM:

Multi-SERDES PHY SATA3/PCIe2/XAUI/Fiber Channel

INNOSILICON ADVANTAGES:

Low power consumption
Fully customizable
Small area
Simple integration process
Available options include
- Test chips and test boards
- FPGA integration support
- Chip level integration

EXAMPLE APPLICATIONS:

Portable hard or flash drive
Video Camera
High speed fiber/copper backplane
High speed backplane device
Internal hard drive

TELL US WHAT YOU NEED We will provide a solution customized to best fit your needs.

Serdes Q&A

What processes are available?

GF 14LPP
SMIC 28PS, GF 28SLP, TSMC 28HPM, TSMC 28HPC, TSMC 28HPC+
SMIC 40LL, TSMC 40G, TSMC 40LP
SMIC 55LL, GF 55LPX, SMIC 65LL, TSMC 65GP, TSMC 65LP
SMIC 90G, SMIC 90LL
SMIC 110G
SMIC 130G

What package can you choose?

Supports small form-factor LQFP/LQFN; Supports BGA

What makes our Serdes different?

Supports multi-protocol combo design of SATA/PCIe/U3/XAUI/FC
Supports multi-channel design, sharing common module to reduce die size and package pin number
Compatible with various types of package, such as LQFP/LQFN, WB/FC, and BGA