Excellent Back-end Design Capabilities
Excellent Back-end Design Capabilities

Design Characteristics

  • ● High Density with best PPA
  • ● Large Die Sizes: > 600mm²
  • ● Max Performance: >2.5GHz CPU/GPU Core
  • ● High-Bandwidth Memory Interfaces: HBM3, GDDR6/7, DDR5, LPDDR5x
  • ● High-Speed Connectivity Interfaces: PCIe Gen5,
  • ● CXL 2.0, USB4/3.2, 100G Ethernet, MIPI CSI/DSI, UCIe 1.1 D2D

Highlights and Advantages

  • ● Over 200+ successful tapeout records
  • ● Target on advanced Finfet nodes: 3/4/5/6/7/8/12/14nm
  • ● 18+ years back-end experience and over 200+ people team.

Customized Optimization for Specific Process Libraries:

  • ● Clock tree optimization
  • ● Manual optimized layout
  • ● Using customized cells
Foundry Partners
Foundry Partners
Foundry Partners Foundry Partners
Successful Use Cases
Successful Use Cases
5nm HPC
Use Cases for Physical Back-end Design
12nm Edge AI
Use Cases for Physical Back-end Design
7nm Media
Use Cases for Physical Back-end Design
10nm ADAS
Use Cases for Physical Back-end Design

Discover how we can streamline your next product design process!

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