GDDR6X/6 Combo PHY & Controller
Combo PHY & Controller
The Innosilicon system-aware design methodology used for IP Cores delivers a customer-focused experience with improved time-to-market and first-time-right quality. Innosilicon offers flexible delivery of IP cores and will work directly with the customer to provide a full system signal and power integrity analysis, creating an optimized chip layout. In the end, the customer receives a hard macro solution with a full suite of test software for quick turn-on, characterization, and debugging.
GDDR6-20Gbps NRZ Eye Diagram
GDDR6-20Gbps NRZ
GDDR6X-24Gbps PAM4 Eye Diagram
GDDR6X-24Gbps PAM4
  • Highlights
  • Features
  • Standard Deliverables
  • Example Applications
  • High bandwidth, Process Friendly(14/12nm down to 3nm)
  • GDDR6/6X combo PHY & controller in Mature High Volume
  • Package & PCB services, Supports GDDR6/6X up to 24Gbps
  • From A to Z Support: IP integration, Packaging/Testing, system optimization and production support
  • Combo for GDDR6 with data rate up to 20Gbps (GDDR6) and 24Gbps (GDDR6X)
  • Pseudo open drain (POD‐135) compatible outputs
  • Driver strength and ODT auto calibration
  • PHY independent auto Command Address Training
  • PHY independent software Command Address Training
  • PHY independent auto WCK2CK Training
  • PHY independent auto Read Training
  • PHY independent software Read Training
  • PHY independent RX Vref Training
  • PHY independent auto Write Training
  • PHY independent software Write Training
  • Supports WDBI/RDBI/CABI functions
  • Supports EDC QDR/DDR modes
  • Rx DFE for data inputs, with receiver characteristics programmable per pin
  • Supports both Write and Read CRC
  • Per bit Tx and Rx data phase delay and VREF adjustment
  • Internal high performance low jitter PLL
  • Tx de-emphasis EQ and Rx DFE EQ to improve signal integrity
  • Supports both Quad data rate (QDR) and double data rate (DDR) data (WCK) modes
  • Supports dynamic Read Training/Write Training with auto-refresh synchronize function
  • Supports accommodate Voltage/Temperature timing drift
  • Supports independent TX/RX/CMD delay line
  • Supports FR4 PCB material
  • Optional package/PCB design and SIPI analysis service
  • Supports Micron, Samsung, Hynix memory devices
  • LEF
  • Place-and-route abstracts
  • GDSII files
  • LVS netlists
  • Optional extracted HSPICE netlist for I/Os
  • Data book, Application notes
  • Silicon validation and ESD testing results
  • Optional PCB reference design and Package Electrical Model
  • Documentation
Use Cases for GDDR6X/6

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