High-Speed Mixed Signal IP Core
Advanced IPs and Customization
Advanced IPs and
Customization
Leveraging over 18 years of technology expertise, Innosilicon offers comprehensive support for high-speed mixed signal IP cores across processes ranging from 130nm to 5nm. Our solutions cater to large and rapidly expanding markets including data centers, cloud servers (public/private), automotive, 5G communications, industrial sectors, and IoT. We are committed to delivering production-ready, silicon-proven IP products that can be customized to precisely meet your unique requirements.
Innosilicon IP & Full Front to Back SOC Design Services
Innosilicon IP & Full Front
to Back SOC Design Services
IP Selector
Innosilicon IP & Design Services Platforms
Innosilicon IP &
Design ServicesPlatforms
IP Portfolio
Covering Process Nodes Across TSMC/SAMSUNG/GF/UMC/SMIC
3/4/5
nm
6/7
nm
8/10
nm
12/14/16
nm
22/28
nm
40
nm
55/65
nm
High-speed Interface PHY&Controller UCIe Chiplet PHY & Controller (D2D & C2C)
HBM3E PHY & Controller
GDDR7/6X/6 Combo PHY & Controller
LPDDR5X/5/4X/4 Combo PHY & Controller
DDR5/4 Combo PHY & Controller (MCR & Regular)
PSRAM/DDR3/LPDDR3 PHY & Controller
USB4/3.2/3.1/3.0/2.0/eUSB2 PHY & Controller
PCIe5.0/4.0 & CXL2.0 PHY& Controller √* √* √*
64/56/32G High-speed SerDes (Ethernet/PCIe6/JESD204B/JESD204C/CPRI/SAS4/SATA3/RapidIO/XAUI)
MIPI C/D Combo PHY & Controller
HDMI2.1/HDMI2.0/eDP PHY & Controller
V-By-One/LVDS PHY & Controller
eMMC5.1/SD3.01/SDIO3.0 PHY & Controller
ONFI5.1 PHY & Controller
AD, DA,Codec (ADC, DAC) Cap/Capless Audio Codec (96dB)
HD Video DAC (10 bit up to 350Mhz)
Pipe-line ADC,12 bit High-speed ADC
Analog and Digital Building Blocks PVT Sensor, Fractional PLL
DC-DC buck/LDO, POR/BG
PUF Security (Physical Unclonable ID/Key)
4K ISP Digital Core
I3C
IP Customization & Integration 2.5D/3D Packaging Design, SI/PI Services
MPW & Full Production Services
IP & ASIC Design Services
Our IP Advantages
High integration, low BOM cost
Worry-free integration, power and I/O optimization for small silicon area, PPA customization to perfectly meet customer’s application scenarios, fast one-stop integration with optimal area, power consumption and packaging.
High cost-performance and high reliability
A variety of comprehensive PHY & Controller solutions and Combos to fit various application scenarios, with high-reliability, high-performance, high-security, and highly scalable design. Fully supports all mainstream FinFET processes.
Best practice, all-around optimization
One-stop PHY & Controller package and a full set of PCB and SI/PI, supporting full-custom hard macro and SI packaging solution including process/chip/package/PCB all-around optimization, within a short customization cycle of 2 to 3 months.
Customer-oriented Service
Best-fit service for customers through support for various FPGA integration, SoC integration, and specialized mass production, including a full custom solution of cross-design, cross-process, and cross-package.

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