High integration, low BOM cost
Worry-free integration, power and I/O optimization for small
silicon area, PPA customization to perfectly meet customer’s
application scenarios, fast one-stop integration with optimal
area, power consumption and packaging.
High cost-performance and high reliability
A variety of comprehensive PHY & Controller solutions and Combos
to fit various application scenarios, with high-reliability,
high-performance, high-security, and highly scalable design. Fully
supports all mainstream FinFET processes.
Best practice, all-around optimization
One-stop PHY & Controller package and a full set of PCB and SI/PI,
supporting full-custom hard macro and SI packaging solution
including process/chip/package/PCB all-around optimization, within
a short customization cycle of 2 to 3 months.
Customer-oriented Service
Best-fit service for customers through support for various FPGA
integration, SoC integration, and specialized mass production,
including a full custom solution of cross-design, cross-process,
and cross-package.
