Innosilicon UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heterogeneous integration for performance and efficiency gains. It supports die-to-die (D2D), chip-to-chip (C2C), interposer and PCB connectivity, ideal for data centers, 5G, HPC, and AI. The IP family includes UCIe-S (24Gbps/pin, 100um~150um pitch) for MCM/short PCB, and UCIe-A (32Gbps/pin, 25um~55um pitch) for silicon interposers. Both support scalable bandwidth (UCIe-A: 2048Gbps; UCIe-S: 384Gbps) with scalability for 1/2/4/8 modules and are compatible with UCIe standard and advanced package version.