Innosilicon’s AI Boosting HMC Memory chip is apply to high speed, high bandwidth, high performance storage field such as AI edge side, Data center, Automatic and so on.
This HMC memory embeds AI operation instructions and implements edge side onsite calculation and storage. It adopt difference serdes technology to transmit data, is away from CPU. The advantage is not limited by PCB board wire distance, can finish far field and near field transmission perfectly. Besides, on basis of HMC2.1(Hybird Memory Cube) protocol, the chip integrate GDDR6 IP and SIP Memory Cube of Sasumg or Micron on a die. Because of its high integration level and the small area, the chip’s cost is lower than HBM technology. For the fpga of Xilinx and Altera use the HMC1.1 protocol, Innosilicon’s HMC Memory chip can substitute perfectly the recently market products.
Innosilicon’s AI Boosting HMC Memory takes high efficiency to a new level. With innovations from Innosilicon, this high efficiency becomes possible with chip architecture. The memory chip is made as efficient as an application specific integrated circuit (ASIC).