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Innosilicon Participated in Many International Exhibitions with its HPC "IP three-piece set"

  • Thursday, July 4, 2024   |
  • From April to May 2024, Innosilicon participated in TSMC's technology seminars in North America (Santa Clara, Austin, Boston, Europe, and Shanghai); Design & Reuse North America, and other international exhibitions with its core product HPC "IP three-piece set", creating an "Innosilicon whirlwind" in the market.

TSMC Series of Seminars: Competing with International Giants

Santa Clara, CA on April 24th; Austin, TX on May 2nd; Boston, MA on May 9; Amsterdam, Netherlands on May 14th; Shanghai, China on May 28th... As a signed partner of TSMC, Innosilicon participated in TSMC's 2024 Global Technology Seminars throughout TSMC’s whole tour, and Innosilicon exhibited its self-developed AI large model "IP three-piece set", competing with international chip design giants on the same stage and presenting its cutting-edge hard technology.

AI big models are surging upward in markets in the U.S. and abroad, and they are quickly being applied in various industries. Innosilicon has independently developed the HPC "IP three-piece set" for the AI big model market: the only silicon-proven HBM3E Combo IP in China, and the only HBM3E/2E compatible IP in the world; the world's first and fastest GDDR6X/6 Combo IP; the only chiplet technology compatible with UCIe international standards and China's independent standards, as well as Serdes/PCIE5.0 technology that matches international top levels.

These products all meet international advanced standards, have comprehensive protocol coverage, and cover the mainstream processes from 55nm to 3nm in major foundries around the world. As soon as they were unveiled, they attracted a lot of attention.

Design & Reuse IP SOC Days North America: Introducing Innosilicon to the World

On April 25, at the Design & Reuse IP SOC Day North America, Innosilicon not only exhibited its core product, the Innosilicon HPC "IP Three-Piece Set", but CEO Gordon Ao also presented a speech entitled "High Performance UCIe Chiplet and Memory Subsystems Optimized to Turbo Charge Next Gen AI-SOC". It introduced the development history, core products, and key cutting-edge technologies of Innosilicon to participants from all over the world, giving a vivid and scientific outlook and description of the development and application prospects of AI big models and key technologies.