Innosilicon has advanced system level packaging (SiP) assembly technology and testing methods, and has established a mature SiP ecosystem. By adopting Innosilicon SiP service, customers will receive products with smaller dimensions, better electrical performance, lower power consumption, faster time to market, and cost competitiveness.
Traditional and Advanced Packaging
Advanced Exposed Die Packaging
Advanced Package Solution Category-TSV and 2.5D/3D Packaging
High Density Organic Substrate Design
Area: 60*60mm2
Layers: 16+
Warpage Simulation Example