Thursday, July 4, 2024

Innosilicon Participated in Many International Exhibitions with its HPC "IP three-piece set"

From April to May 2024, Innosilicon participated in TSMC's technology seminars in North America (Santa Clara, Austin, Boston, Europe, and Shanghai); Design & Reuse North America, and other international exhibitions with its core product HPC "IP three-piece set", creating an "Innosilicon whirlwind" in the market.