Innosilicon provides simulation services for signal integrity and power integrity of packaging and PCB designs, guiding the high-speed design of packaging and PCB to ensure that the quality of high-speed signals can meet the requirements.
Innosilicon boasts a complete SI/PI team that works on accelerated substrate and system design indicators convergence. Services available include, but are not limited to: IR drop, Current Density, insertion loss/return loss/crosstalk analysis, inductance, EYE sim, Power ripple, PDN, capacitor optimization, and PKG/PCB suggestion.
Passive simulation
Package inductance scan
Eye diagram
