Leveraging over 19 years of technology expertise, Innosilicon offers comprehensive support for high-speed mixed signal IP cores across processes ranging from 65nm to 3nm. Our solutions cater to large and rapidly expanding markets including data centers, cloud servers (public/private), automotive, 5G communications, industrial sectors, and IoT. We are committed to delivering production-ready, silicon-proven IP products that can be customized to precisely meet your unique requirements.
Worry-free integration, power and I/O optimization for small silicon area, PPA customization to perfectly meet customer's application scenarios, fast one-stop integration with optimal area, power consumption and packaging.
A variety of comprehensive PHY & Controller solutions and Combos to fit various application scenarios, with high-reliability, high-performance, high-security, and highly scalable design. Fully supports all mainstream FinFET processes.
One-stop PHY & Controller package and a full set of PCB and SI/PI, supporting full-custom hard macro and SI packaging solution including process/chip/package/PCB all-around optimization, within a short customization cycle of 2 to 3 months.
Best-fit service for customers through support for various FPGA integration, SoC integration, and specialized mass production, including a full custom solution of cross-design, cross-process, and cross-package.
