September 26, 2025
Santa Clara, Calif., September 24, 2025 - Innosilicon, a well-recognized provider of advanced memory interface IP and ASIC design services for AI silicon platforms, announced today its participation in the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum. At the event, the company will showcase its leadership in ready-to-deploy AI solutions, featuring high-speed memory, SerDes, and chiplet subsystems, with a spotlight on its LPDDR6/5X Combo offering.
Innosilicon’s IP portfolio includes a wide range of advanced high-speed interface subsystems. The key IP Trio for Next Gen AI, such as LPDDR6/5X Combo, GDDR7/6X, MR DDR5, UCIe Chiplet, UALINK, PCIe 6.0/5.0,112G SerDes solutions, and more.
With one of the industry's most advanced memory interface solutions, Innosilicon empowers customers to overcome the memory wall and accelerate leadership along the high-bandwidth AI innovation curve. It has supported over 300 top-tier global customers, contributed to more than 10 billion SoCs, and delivered silicon-proven IP across advanced process nodes at leading foundry TSMC, ranging from 28nm down to 3nm technologies including 28nm, 22nm,16/12nm, 7nm (including N6), 5nm (including N4), and 3nm processes.
To tackle key memory bottlenecks in AI workloads, Innosilicon introduced its cutting-edge LPDDR6/5X Combo PHY + Controller IP, fully compatible with TSMC’s N6 and N3 process technologies. At the TSMC North America OIP Ecosystem Forum, the company also will present its latest paper, “Shaping the Future of Memory Interfaces: LPDDR6/5X Combo Subsystem for AI, Security, Automotive, and Beyond,” highlighting its leadership in next-generation interface solutions.
The Innosilicon dual-protocol LPDDR6/5X Combo achieves peak performance of 14.4Gbps at core voltage in LPDDR6 mode. This high-speed capability suffices for numerous application scenarios with stringent data transmission speed requirements.
"Looking ahead, Innosilicon will further strengthen its collaboration with TSMC to drive the development of next-generation technologies, reinforcing its position as a one-stop leader in High-Speed IP and ASlC design services." said Farzad Zarrinfar, Senior Vice President of Sales & Marketing at lnnosilicon.
About Innosilicon
Innosilicon is a global leader and one-stop provider of high-speed interface IP and ASIC design services, with a proven track record since 2006. Trusted by hundreds of customers worldwide, including many of the industry's top-tier semiconductor vendors. Innosilicon delivers scalable solutions across all major process nodes, from 65nm down to 3nm. With a team of over 1,300 employees, the company remains fully committed to advancing its leadership in delivering advanced IPs and ASIC design services. Our team delivers a diverse portfolio of specialized IPs—including GDDR7/6X/6, LPDDR6/5X, MR DDR5, PCIe 6.0/5.0, UCIe Chiplet, UALink, and 112G SerDes—available in both standard PHY + Controller configurations and fully customizable designs. These solutions have been successfully deployed across high-performance computing, high-bandwidth memory, automotive, multimedia, low-power IoT, and other advanced application domains, demonstrating our commitment to innovation and system-level excellence. We help customers succeed by accelerating time-to-market through our deep domain expertise and flexible service model.